NXP Semiconductors - MPC860PCVR50D4

MPC860PCVR50D4 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MPC860PCVR50D4
Description MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;
NAME DESCRIPTION
Minimum Supply Voltage: 3.135 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Integrated Cache: YES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.52 mm
Sub-Category: Microprocessors
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 357
Terminal Position: BOTTOM
Format: FIXED POINT
Package Style (Meter): GRID ARRAY
Address Bus Width: 32
Technology: CMOS
JESD-30 Code: S-PBGA-B357
Maximum Clock Frequency: 50 MHz
Package Shape: SQUARE
Terminal Form: BALL
Package Code: BGA
Width: 25 mm
Moisture Sensitivity Level (MSL): 3
Speed: 50 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: 3.465 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Bit Size: 32
JESD-609 Code: e1
Qualification: Not Qualified
Package Equivalence Code: BGA357,19X19,50
Length: 25 mm
Peak Reflow Temperature (C): 245
Terminal Pitch: 1.27 mm
Power Supplies (V): 3.3
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products