NXP Semiconductors - MIMX8MQ6DVAJZAA

SYSTEM ON CHIP;

CAPACITIVE TOUCH SCREEN CONTROLLERS; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE; Width: 6 mm;

Other uPs/uCs/Peripheral ICs; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 49; Package Code: FBGA; Package Shape: SQUARE;

P82B715DG4 by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 12V, operating b/w -40°C to 85°C. It features I2C bus compatibility, clock frequency up to 0.4MHz, and is ideal for industrial applications requiring microprocessor circuits in a small outline package.

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

NXP Semiconductors' MIMXRT1172CVM8A is a low-profile, fine-pitch SoC with 289 terminals. Operating b/w -40 to 105°C, it supports a supply voltage range of 1.1-1.15V. Ideal for applications requiring high-performance uPs/uCs in compact form factors.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;

ESP32-C3-MINI-1U-H4 by Espressif Systems (Shanghai) is a 53-terminal SoC with max supply voltage of 3.6V and operating temp range from -40 to 105°C. Ideal for IoT applications due to its compact rectangular package style, CMOS technology, and low nominal voltage of 3.3V.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 491; Package Code: LFBGA; Package Shape: SQUARE;

The Xilinx XC7Z030-1FBG676C is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage ranging from 0.95V to 1.05V. With a package style of Grid Array and 676 terminals, it's ideal for various applications in Other Function uPs,uCs & Peripheral ICs.

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; Package Code: BGA; Package Shape: UNSPECIFIED; Package Style (Meter): GRID ARRAY; Technology: CMOS;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 33; Package Code: VFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;

XCZU7EV-3FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage of 0.9 V. This GRID ARRAY package is ideal for industrial applications requiring high performance in a compact form factor.

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;