NXP Semiconductors - MCF5307AI66B

AM3358BZCZ100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and a max clock frequency of 26 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;

MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

AT91RM9200-QU-002 by Microchip Technology is a 32-bit ARM7 microprocessor with integrated cache and 26-bit address bus width. It operates at a max clock frequency of 80 MHz, suitable for industrial applications requiring high-speed processing. With low power mode and 94 I/O lines, it offers efficient performance in compact designs.

MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Width: 25 mm;

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: LFQFP; Package Shape: SQUARE; Package Equivalence Code: QFP176,1.0SQ,20;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

AM3358BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply voltage range of 0.95-1.1 V and boundary scan feature.