NXP Semiconductors - MC34118P

  1. Home
  2. NXP Semiconductors - MC34118P
MC34118P by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MC34118P
Description SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet MC34118P Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Seated Height: 5.08 mm
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: 8 mA
Terminal Finish: TIN LEAD
No. of Terminals: 28
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T28
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 60 Cel
Package Code: DIP
Width: 15.24 mm
Telecom IC Type: SPEAKER PHONE CIRCUIT
JESD-609 Code: e0
Minimum Operating Temperature: -20 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP28,.6
Length: 36.83 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 5
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

TCM5092N by Texas Instruments

TCM5092N

Texas Instruments

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
LT1684CN by Analog Devices

LT1684CN

Analog Devices

TELEPHONE RINGER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
KS5811N by Samsung

KS5811N

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
KS58527E by Samsung

KS58527E

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR;
TEA7540FP by STMicroelectronics

TEA7540FP

STMicroelectronics

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1062AT by NXP Semiconductors

TEA1062AT

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TA31066F by Toshiba

TA31066F

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
TC35204P by Toshiba

TC35204P

Toshiba

TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
TEA1095TSDB-T by NXP Semiconductors

TEA1095TSDB-T

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
TCM5092J by Texas Instruments

TCM5092J

Texas Instruments

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1098TV/C2 by NXP Semiconductors

TEA1098TV/C2

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
TA31076F-TP2 by Toshiba

TA31076F-TP2

Toshiba

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: SSOP; Package Shape: RECTANGULAR;
KS58C21P by Samsung

KS58C21P

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 22; Package Code: SDIP; Package Shape: RECTANGULAR;
TA31032F by Toshiba

TA31032F

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
PBD3535 by STMicroelectronics

PBD3535

STMicroelectronics

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TCM1512BP by Texas Instruments

TCM1512BP

Texas Instruments

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TC35205P by Toshiba

TC35205P

Toshiba

TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
MC34118DWR2 by Motorola

MC34118DWR2

Motorola

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
TA31066F-TP2 by Toshiba

TA31066F-TP2

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD3310FP by NXP Semiconductors

PCD3310FP

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;