NXP Semiconductors - MC13156DW

  1. Home
  2. NXP Semiconductors - MC13156DW
MC13156DW by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number MC13156DW
Description CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet MC13156DW Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Maximum Seated Height: 2.65 mm
Surface Mount: YES
Maximum Supply Current: 8 mA
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 24
Package Equivalence Code: SOP24,.4
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Length: 15.395 mm
Technology: BIPOLAR
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Nominal Negative Supply Voltage: -3 V
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: SOP
Width: 7.5 mm
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

SC14CVMDECTSF02T by Renesas Electronics

SC14CVMDECTSF02T

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Moisture Sensitivity Level (MSL): 3;
CGY2032TS by NXP Semiconductors

CGY2032TS

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
UAA2068G by NXP Semiconductors

UAA2068G

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;
PCD5041H by NXP Semiconductors

PCD5041H

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;
TA31136FN by Toshiba

TA31136FN

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
MC13110AFTA by NXP Semiconductors

MC13110AFTA

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Length: 7 mm;
935277002118 by NXP Semiconductors

935277002118

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
MC13111AFB by NXP Semiconductors

MC13111AFB

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Maximum Seated Height: 2.45 mm;
UBA1707TS by NXP Semiconductors

UBA1707TS

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
TA31101P by Toshiba

TA31101P

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
953220640118 by NXP Semiconductors

953220640118

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA58640DK by NXP Semiconductors

SA58640DK

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31132FN-TP1 by Toshiba

TA31132FN-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LSSOP; Package Shape: RECTANGULAR;
PCD5090HZ by NXP Semiconductors

PCD5090HZ

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
TA31103F by Toshiba

TA31103F

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
TB31262F by Toshiba

TB31262F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE;
KA8508A by Samsung

KA8508A

Samsung

Cordless Telephone ICs; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
935220650518 by NXP Semiconductors

935220650518

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TA31136F by Toshiba

TA31136F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD50922H by NXP Semiconductors

PCD50922H

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;