NXP Semiconductors - SA58640DK

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SA58640DK by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SA58640DK
Description CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
Datasheet SA58640DK Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 5 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.5 mm
Surface Mount: YES
Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)
No. of Terminals: 20
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
JESD-30 Code: R-PDSO-G20
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Package Code: LSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 1
Telecom IC Type: CORDLESS TELEPHONE SUPPORT CIRCUIT
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Qualification: Not Qualified
Length: 6.5 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
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