NXP Semiconductors - BR100/03

BR100/03 by NXP Semiconductors

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Manufacturer	NXP Semiconductors
Manufacturer's Part Number	BR100/03
Description	DIAC; Package Style (Meter): LONG FORM; Surface Mount: NO; Terminal Position: AXIAL; Configuration: SINGLE; Case Connection: ISOLATED;
Datasheet	BR100/03 Datasheet

BR100/03 Technical Details

NAME	DESCRIPTION
Package Body Material:	GLASS
Trigger Device Type:	DIAC
Maximum Breakdown Voltage:	36 V
Configuration:	SINGLE
JEDEC-95 Code:	DO-35
Sub-Category:	DIACs
Surface Mount:	NO
No. of Terminals:	2
Qualification:	Not Qualified
Terminal Position:	AXIAL
Package Style (Meter):	LONG FORM
JESD-30 Code:	O-LALF-W2
Minimum Breakdown Voltage:	28 V
No. of Elements:	1
Package Shape:	ROUND
Terminal Form:	WIRE
Maximum Operating Temperature:	100 Cel
Case Connection:	ISOLATED

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