Taiwan Semiconductor - DB3TGRI

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DB3TGRI by Taiwan Semiconductor

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Manufacturer Taiwan Semiconductor
Manufacturer's Part Number DB3TGRI
Description DIAC; Package Style (Meter): LONG FORM; Surface Mount: NO; Terminal Position: AXIAL; Configuration: SINGLE; Case Connection: ISOLATED;
Datasheet DB3TGRI Datasheet
NAME DESCRIPTION
Package Body Material: GLASS
Trigger Device Type: DIAC
Maximum Breakdown Voltage: 34 V
Configuration: SINGLE
JEDEC-95 Code: DO-35
Surface Mount: NO
Terminal Finish: TIN
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
No. of Terminals: 2
Terminal Position: AXIAL
Package Style (Meter): LONG FORM
JESD-30 Code: O-LALF-W2
Minimum Breakdown Voltage: 30 V
No. of Elements: 1
Package Shape: ROUND
Terminal Form: WIRE
Maximum Operating Temperature: 125 Cel
Case Connection: ISOLATED
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