NXP Semiconductors - MCIMX6Q6AVT10AE

MCIMX6Q6AVT10AE by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number MCIMX6Q6AVT10AE
Description SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Datasheet MCIMX6Q6AVT10AE Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.35 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SoC
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Supply Voltage: 1.5 V
Maximum Seated Height: 2.16 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Terminals: 624
Package Equivalence Code: BGA624,25X25,32
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Length: 21 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B624
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 125 Cel
Peak Reflow Temperature (C): 260
Package Code: FBGA
Width: 21 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 3
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