Micron Technology - MTFC4GLDDQ-4MIT

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Length: 7 mm;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

TMS320DM365ZCED30 by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a 32-bit external data bus width and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package style with a grid array layout.

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

ST33HTPH2E28AHD0 by STMicroelectronics is a 28-terminal IC with CMOS technology, operating b/w -40 to 105°C. It's a cryptographic authenticator with 1.8V supply voltage, suitable for secure applications requiring compact design and surface mount compatibility.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;

Other uPs/uCs/Peripheral ICs;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

AM6231ASGGHAALW by Texas Instruments is a 425-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715V to 0.79V. This IC is ideal for applications requiring a very thin profile and fine pitch grid array package style.

MICROPROCESSOR CIRCUIT; Terminal Finish: TIN SILVER COPPER;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

PROGRAMMABLE SoC; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, SHRINK PITCH;

SoC;

PSoC;

EFR32MG12P432F1024GM48-CR by Silicon Labs is a System on Chip with 48 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.8V to 3.8V and utilizes CMOS technology. This chip carrier with a very thin profile is suitable for various applications requiring low power consumption and compact design.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.