Cypress Semiconductor - CY8CPLC10-28PVXI

SoC; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;

NXP Semiconductors PN7150B0HN/C11006Y is a NFC controller with 40 terminals, operating voltage range of 1.65V to 1.95V, and max temp of 85°C. Ideal for applications requiring low-profile chip carriers in surface-mount technology.

SoC;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;

Microchip ATECC608B-MAHDA-S is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85 °C, supports 2-5.5 V supply voltage range, and comes in a small outline package suitable for industrial applications.

MCIMX6Y0DVM05AA by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.275-1.5 V. Ideal for applications requiring low profile, fine pitch GRID ARRAY package style.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

ESP32-C3FN4 by Espressif Systems (shanghai) Operates at 3.6V, -40 to 85°C temp range, CMOS tech. Ideal for microprocessor circuits in IoT devices due to its small size (5x5mm), low power consumption, and quad terminal position.

FXLC95000CLR1 by NXP Semiconductors is a CMOS microprocessor circuit with 24 terminals and a rectangular package shape. It operates at a min supply voltage of 1.71V and has an industrial temperature grade of -40 to 85°C. This peripheral IC is suitable for various applications requiring low voltage and compact size.

XCZU5CG-2SFVC784I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in an industrial temperature range from -40 to 100 °C and has a nominal voltage of 0.85 V. This device, featuring a GRID ARRAY package style, is suitable for various applications requiring high-performance processing capabilities.

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;

FT245RQ-TRAY by FTDI is a 32-terminal chip carrier with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. With a terminal pitch of 0.5 mm, it is ideal for microprocessor circuits requiring supply voltage b/w 3.3 V to 5.25 V.

CC-WMX-J97C-TN by Digi International is a 400-terminal microprocessor circuit with CMOS technology. It operates b/w -20°C to 70°C, in a square grid array package style measuring 50mm x 50mm. Ideal for applications requiring high-performance processing in compact spaces.

MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;