Linear Technology - LTC5552IUDB#TRMPBF

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Minimum Operating Frequency: 1700 MHz;

IMAGE REJECTION; Maximum Input Power (CW): 20 dBm; Maximum Conversion Loss: 11 dB; Maximum Operating Frequency: 8500 MHz; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Power Supplies (V): 5;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Terminal Finish: MATTE TIN;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 20000 MHz; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED;

Analog Devices' HMC558ALC3B is a ceramic RF/Microwave Mixer with 12 terminals. It operates from -40 to 85°C, handling up to 25 dBm CW input power. Featuring double balanced design, it offers a frequency range of 5.5-14 GHz, with low conversion loss ideal for various RF applications.

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Technology: GAAS; Construction: COMPONENT; Terminal Finish: Gold (Au); Package Equivalence Code: DIE OR CHIP; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Construction: COMPONENT; Maximum Input Power (CW): 20 dBm; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel; Maximum Operating Frequency: 1200 MHz;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Construction: COMPONENT; Maximum Input Power (CW): 15 dBm;

SINGLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 32; Package Body Material: PLASTIC/EPOXY; Technology: CMOS; Minimum Operating Frequency: 1500 MHz;

DOUBLE BALANCED; Minimum Operating Frequency: 25000 MHz; Minimum Operating Temperature: -55 Cel; Maximum Conversion Loss: 11.5 dB; Construction: COMPONENT; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 3000 MHz; Terminal Finish: Tin/Lead (Sn/Pb); Construction: COMPONENT; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; JESD-609 Code: e3; Minimum Operating Temperature: -40 Cel; Minimum Operating Frequency: 2300 MHz; Maximum Operating Temperature: 85 Cel; Maximum Operating Frequency: 4000 MHz;

DOUBLE BALANCED; Maximum Operating Temperature: 100 Cel; Construction: MODULE; Maximum Input Power (CW): 23 dBm; Additional Features: HIGH ISOLATION; Minimum Operating Temperature: -55 Cel;

DOUBLE BALANCED; Terminal Finish: Matte Tin (Sn); Maximum Operating Frequency: 1200 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel;

IMAGE REJECTION; JESD-609 Code: e4; Terminal Finish: Gold (Au); Maximum Conversion Loss: 11 dB; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: LCC12,.08X.12,20; Maximum Supply Current: 150 mA;