Intel - 10M02SCM153I7G

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

ICE40UP5K-UWG30ITR by Lattice Semiconductor is a CMOS FPGA with 660 CLBs, operating at -40 to 100 °C. It has a max supply voltage of 1.26 V and package style of GRID ARRAY for industrial applications requiring high performance in compact designs.

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 130;

M1A3P250-PQG208I by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. It operates b/w -40 to 100 °C, with supply voltage range of 1.425V to 1.575V. Suitable for industrial applications requiring high gate count and programmable logic functions.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 169; Package Code: BGA; Package Shape: SQUARE;

The Intel 10M25DAF256C8G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at a voltage range of 1.15V to 1.25V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed processing and programmable logic capabilities in various electronic systems.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

The EP3C40F324I7N by Altera is a CMOS Field Programmable Gate Array with 39,600 logic cells. It has a maximum clock frequency of 472.5 MHz and operates in an industrial temperature range. Its compact BGA package makes it suitable for various applications requiring high performance and programmability.

M2GL090T-1FG676I by Microchip Technology is a CMOS FPGA with 86316 logic cells, 425 inputs/outputs, and operates at temperatures from -40 to 100°C. It comes in a plastic/epoxy package with a grid array style, suitable for industrial applications requiring high-performance programmable ICs.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

LCMXO2-1200HC-4TG100C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. Operating at 85°C, it has 79 inputs/outputs and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-speed processing in compact designs.

Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.