Intel - 10M25DAF256C8G

10M25DAF256C8G by Intel

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Manufacturer Intel
Manufacturer's Part Number 10M25DAF256C8G
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
Datasheet 10M25DAF256C8G Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.15 V
Package Body Material: PLASTIC/EPOXY
Organization: 1563 CLBS
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.55 mm
No. of Inputs: 360
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 360
Position Of Terminal: BOTTOM
No. of Terminals: 256
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B256
Package Shape: SQUARE
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: OTHER
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.25 V
Nominal Supply Voltage (V): 1.2
No. of Logic Cells: 25000
No. of CLBs: 1563
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)
Length: 17 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): NOT SPECIFIED
Power Supplies (V): 1.2
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