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| Manufacturer | Integrated Device Technology |
|---|---|
| Manufacturer's Part Number | 72V235L10TFG8 |
| Description | OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | 72V235L10TFG8 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .005 Amp |
| Organization: | 2KX18 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.6 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 30 mA |
| Cycle Time: | 10 ns |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 64 |
| Maximum Clock Frequency (fCLK): | 100 MHz |
| No. of Words: | 2048 words |
| Terminal Position: | QUAD |
| Package Style (Meter): | FLATPACK, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | S-PQFP-G64 |
| Package Shape: | SQUARE |
| Terminal Form: | GULL WING |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LFQFP |
| Width: | 10 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 36864 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Output Enable: | YES |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | QFP64,.47SQ,20 |
| Length: | 10 mm |
| Maximum Access Time: | 6.5 ns |
| No. of Words Code: | 2K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | EASILY EXPANDABLE IN DEPTH AND WIDTH |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3.3 |
