Integrated Device Technology - 72V845L15PFGI8

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Length: 13.995 mm;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 36864 bit;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 147456 bit;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 20 ns;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: LFQFP; Package Shape: SQUARE; Cycle Time: 20 ns;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Terminal Pitch: .5 mm;

OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: CERAMIC, GLASS-SEALED;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G28;

FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 64 bit;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; JESD-609 Code: e4;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE; Additional Features: IT CAN OPERATES ASYNCHRONOUS MODE ALSO;

The Renesas Electronics 72V82L20PAGI is a small outline, thin profile, shrink pitch FIFO memory IC with a capacity of 1Kx9 words. It operates asynchronously at a max clock frequency of 33.3 MHz and has a temperature range of -40 to 85°C. This IC is commonly used in industrial applications that require high-speed data buffering and storage.

FIFOs; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Memory Density: 147456 bit; Surface Mount: YES;

OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;

SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.