Inrcore - TM1062DVA1

NEO-M8T-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and MSL level of 4, suitable for industrial applications requiring precise positioning and timing accuracy. With its compact rectangular package style, it's ideal for space-constrained environments.

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;

TELECOM CIRCUIT;

TLV320AIC3104IRHBR by Texas Instruments is a 32-terminal telecom IC with 2 channels. It operates b/w -40 to 85°C, suitable for industrial use. The chip carrier package style with a very thin profile and nickel/palladium/gold terminal finish make it ideal for telecom circuit applications.

The U-blox Ag BMD-300-A-R is a surface mount telecom IC with a data rate of 2 Mbps. Operating temperature ranges from -40 to 85°C, suitable for industrial applications. Its package style is microelectronic assembly, making it ideal for various telecom circuit designs.

RN4871U-V/RM118 by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -20 to 70 °C and has a max data rate of 0.01 Mbps. This IC is commonly used in telecom circuits for various applications.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 12; Package Code: VFBGA; Package Shape: RECTANGULAR;

RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;

NEO-M8U-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its compact MICROELECTRONIC ASSEMBLY package makes it ideal for industrial applications requiring a 3V supply voltage. AEC-Q100 and TS 16949 screening ensure high reliability in automotive and telecom systems.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

CC2530F256RHAT by Texas Instruments is a telecom IC with 40 terminals, operating b/w -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no lead terminal form.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Silicon Labs' WT12-A-AI3 is a telecom IC with 31 terminals, CMOS technology, and 3 Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and requires a nominal voltage of 3.3V. This surface-mount rectangular package (14x25 mm) is ideal for telecom interface applications.

TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Width: 10.16 mm;

WL1837MODGIMOCT by Texas Instruments is a telecom interface IC with 100 terminals in a rectangular grid array package. It operates at temperatures from -40 to 85°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for industrial applications requiring high-speed communication in compact spaces.

NRF51822-QFAA-T by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, operating b/w -25 to 75°C. It comes in a square chip carrier package style, suitable for telecom circuit applications due to its very thin profile and quad terminal position.

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE;

BLUENRG-M2SP by STMicroelectronics is a 20-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It comes in a rectangular package style, suitable for industrial applications requiring reliable telecom circuit interfaces. With surface mount capability and compact dimensions of 13.5mm x 11.5mm x 2.5mm, it offers peak reflow temperature of 240°C for efficient assembly processes.