MR25H40MDF by Everspin Technologies | Vyrian | Semiconductor & Electronic Component Distributor

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Manufacturer	Everspin Technologies
Manufacturer's Part Number	MR25H40MDF
Description	MRAM; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
Datasheet	MR25H40MDF Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	512KX8
Maximum Time At Peak Reflow Temperature (s):	40
Maximum Seated Height:	.9 mm
Minimum Supply Voltage (Vsup):	3 V
Sub-Category:	SRAMs
Surface Mount:	YES
No. of Terminals:	8
No. of Words:	524288 words
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Screening Level:	AEC-Q100
Technology:	CMOS
JESD-30 Code:	R-PDSO-N8
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	125 Cel
Package Code:	HVSON
Width:	5 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	4194304 bit
Memory IC Type:	MRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	8
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	SOLCC8,.25
Length:	6 mm
No. of Words Code:	512K
Nominal Supply Voltage / Vsup (V):	3.3
Peak Reflow Temperature (C):	260
Terminal Pitch:	1.27 mm
Temperature Grade:	AUTOMOTIVE
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	3.3

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