Everspin Technologies - MR25H40CDC

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MR25H40CDC by Everspin Technologies

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Manufacturer Everspin Technologies
Manufacturer's Part Number MR25H40CDC
Description MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SON; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3;
Datasheet MR25H40CDC Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512KX8
Maximum Seated Height: 1.05 mm
Minimum Supply Voltage (Vsup): 3 V
Sub-Category: SRAMs
Surface Mount: YES
No. of Terminals: 8
No. of Words: 524288 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: CMOS
JESD-30 Code: R-PDSO-N8
Package Shape: RECTANGULAR
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: SON
Width: 5 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 4194304 bit
Memory IC Type: MRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOLCC8,.25
Length: 6 mm
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 3.3
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
Power Supplies (V): 3.3
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