Analog Devices - HMC140

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 1000 MHz; Construction: COMPONENT;

DOUBLE BALANCED; Package Equivalence Code: DIE OR CHIP; Maximum Operating Frequency: 36000 MHz; Maximum Conversion Loss: 12 dB; Additional Features: USABLE TO 42 GHZ; Construction: COMPONENT;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Minimum Operating Frequency: 700 MHz; Maximum Input Power (CW): 20 dBm; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Additional Features: HIGH ISOLATION; Maximum Operating Temperature: 85 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Minimum Operating Frequency: 1200 MHz;

TRIPLE BALANCED; Maximum Operating Frequency: 3900 MHz; Construction: COMPONENT; JESD-609 Code: e3; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 12 dB;

RF/Microwave Mixers; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 8; Package Body Material: CERAMIC; Technology: BIPOLAR; Screening Level: 38535Q/M;38534H;883B;

DOUBLE BALANCED; Additional Features: 2.92 MM; SMA; Characteristic Impedance: 50 ohm; Construction: COAXIAL; Maximum Operating Temperature: 85 Cel; Maximum Operating Frequency: 14000 MHz;

IMAGE REJECTION; Characteristic Impedance: 50 ohm; Maximum Conversion Loss: 11 dB; JESD-609 Code: e4; Maximum Input Power (CW): 20 dBm; Minimum Operating Temperature: -55 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Power Supplies (V): 4;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Minimum Operating Temperature: -30 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Characteristic Impedance: 50 ohm;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Maximum Operating Frequency: 30000 MHz; Construction: COMPONENT;

DOUBLE BALANCED; Construction: COMPONENT; Terminal Finish: Gold (Au) - with Nickel (Ni) barrier; Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 3000 MHz; JESD-609 Code: e4;

RF/Microwave Mixers;

DOUBLE BALANCED; JESD-609 Code: e4; Terminal Finish: GOLD OVER NICKEL;

DOUBLE BALANCED; Minimum Operating Temperature: -55 Cel; Minimum Operating Frequency: 26000 MHz; Characteristic Impedance: 50 ohm; JESD-609 Code: e4; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Maximum Input Power (CW): 20 dBm; Maximum Conversion Loss: 11 dB; Terminal Finish: MATTE TIN; Minimum Operating Temperature: -40 Cel; Construction: COMPONENT;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 12; Package Body Material: CERAMIC; Technology: GAAS; Terminal Finish: Gold (Au) - with Nickel (Ni) barrier;