NXP Semiconductors - SA611DK

SINGLE BALANCED;

DOUBLE BALANCED; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0;

RF/Microwave Mixers; Technology: GAAS; Power Supplies (V): 5; Maximum Operating Temperature: 125 Cel; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -55 Cel;

DOUBLE BALANCED;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Operating Temperature: 85 Cel;

RF/Microwave Mixers; Technology: GAAS; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 125 Cel;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Characteristic Impedance: 50 ohm;

SINGLE BALANCED; Maximum Conversion Loss: 12 dB; Minimum Operating Frequency: 18000 MHz; Maximum Input Power (CW): 25 dBm; Package Equivalence Code: DIE OR CHIP; Construction: COMPONENT;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Minimum Operating Frequency: 700 MHz; Maximum Input Power (CW): 20 dBm; Minimum Operating Temperature: -40 Cel;

IMAGE REJECTION; Construction: COMPONENT; Maximum Operating Frequency: 13500 MHz; Minimum Operating Temperature: -40 Cel; Maximum Input Power (CW): 20 dBm; Minimum Operating Frequency: 8500 MHz;

DOUBLE BALANCED; Maximum Conversion Loss: 12.5 dB; Characteristic Impedance: 50 ohm; Minimum Operating Temperature: -55 Cel; Maximum Input Power (CW): 18 dBm; Maximum Operating Frequency: 32000 MHz;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Power Supplies (V): 5;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 36; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Package Equivalence Code: LCC36,.25SQ,20;

DOUBLE BALANCED; Characteristic Impedance: 50 ohm; Maximum Conversion Loss: 9 dB; Minimum Operating Temperature: -40 Cel; Minimum Operating Frequency: 4000 MHz; Maximum Input Power (CW): 25 dBm;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOP8,.25;

DOUBLE BALANCED; Minimum Operating Frequency: 5000 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 12000 MHz; Maximum Conversion Loss: 13 dB;

DOUBLE BALANCED; Minimum Operating Frequency: 500 MHz; Maximum Operating Frequency: 1700 MHz; Construction: COMPONENT; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel;

LTC5562IUC#TRMPBF by Analog Devices is a RF/Microwave Mixer with 10 terminals, operating from 0.03 MHz to 7000 MHz. It has a max input power of 15 dBm and operates at temperatures ranging from -40°C to 105°C. Ideal for applications requiring double balanced RF or microwave devices in surface mount construction.

DOUBLE BALANCED; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0;

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel; Maximum Conversion Loss: 11 dB; JESD-609 Code: e3; Construction: COMPONENT;