Altera - 10M04SCE144I7G

LCMXO3LF-9400C-5BG256I by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 9400 logic cells, 1175 CLBs, and 206 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 3.465 V. Ideal for applications requiring high-performance programmable ICs in compact form factors.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;

FIELD PROGRAMMABLE GATE ARRAY;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

The Xilinx XC7A15T-1CSG324C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

FIELD PROGRAMMABLE GATE ARRAY; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;

The Xilinx XC7A75T-2CSG324I is a FPGA with 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for complex designs. With a package style of grid array and low profile, it offers versatile solutions for various electronic systems.

Microchip Technology's MPF100T-1FCG484I is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its grid array package has 484 terminals on a 23x23mm square body, suitable for applications requiring programmable gate arrays in surface-mount technology.

FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE; Surface Mount: YES;

Xilinx XC7A35T-1CSG325C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

LCMXO3LF-4300C-5BG256C by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs. It operates at a voltage range of 2.375V to 3.465V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring field programmable gate arrays with low profile and fine pitch package style.

EP4CE10F17C8N by Intel is a FPGA with 10320 logic cells and 179 inputs/outputs. Operating at a max frequency of 472.5 MHz, it's ideal for applications requiring high-speed processing like telecommunications and signal processing. With a low profile grid array package style, it offers flexibility in design and integration.

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

LCMXO2-256ZE-2SG32C by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs, operating voltage of 1.14V to 1.26V. Ideal for applications requiring low power consumption and high performance in compact form factors like IoT devices and sensor networks.

M2GL060-FCSG325I by Microsemi is a PLASTIC/EPOXY FPGA with a max supply voltage of 1.26V. It has 325 terminals and is suitable for applications requiring a field programmable gate array.

Xilinx XC6SLX45T-2FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for projects demanding versatile programmable ICs in a compact grid array package.