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| Manufacturer | Microchip Technology |
|---|---|
| Manufacturer's Part Number | HCS300-I/P |
| Description | DATA ENCRYPTION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; |
| Datasheet | HCS300-I/P Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 5 V |
| Maximum Seated Height: | 5.33 mm |
| Surface Mount: | NO |
| Maximum Supply Current: | 2.5 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Screening Level: | TS 16949 |
| JESD-30 Code: | R-PDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Telecom IC Type: | DATA ENCRYPTION CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP8,.3 |
| Length: | 9.271 mm |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | INDUSTRIAL |
