Cordless Phone ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Nominal Negative Supply Voltage | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Samsung |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
FLATPACK |
.75 mm |
70 Cel |
-20 Cel |
QUAD |
S-PQFP-G48 |
2.3 mm |
10 mm |
Not Qualified |
10 mm |
|||||||||||||
|
Samsung |
CORDLESS TELEPHONE SUPPORT CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.007 mA |
5 V |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
75 Cel |
-30 Cel |
TIN LEAD |
DUAL |
R-PDSO-G16 |
1.95 mm |
3.95 mm |
Not Qualified |
e0 |
9.9 mm |
|||||||
|
Samsung |
CORDLESS TELEPHONE SUPPORT CIRCUIT |
COMMERCIAL EXTENDED |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
.007 mA |
3 V |
3.3/5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
75 Cel |
-30 Cel |
DUAL |
R-PDSO-G16 |
1.95 mm |
3.95 mm |
Not Qualified |
9.9 mm |
||||||||
|
Samsung |
CORDLESS TELEPHONE SUPPORT CIRCUIT |
COMMERCIAL EXTENDED |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
.007 mA |
5 V |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
75 Cel |
-30 Cel |
TIN LEAD |
DUAL |
R-PDIP-T16 |
5.08 mm |
7.62 mm |
Not Qualified |
e0 |
19.4 mm |
|||||||
|
Samsung |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
SMALL OUTLINE |
1.27 mm |
70 Cel |
-10 Cel |
DUAL |
R-PDSO-G16 |
1.95 mm |
3.95 mm |
Not Qualified |
9.9 mm |
|||||||||||||
|
Samsung |
OTHER |
THROUGH-HOLE |
18 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
CMOS |
13 mA |
3.3/5 |
IN-LINE |
DIP18,.3 |
Cordless Telephone ICs |
2.54 mm |
70 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T18 |
Not Qualified |
e0 |
Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.
Some common types of cordless phone ICs include:
1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.
2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.
3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.
4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.