Cordless Phone ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
935220640112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UBA1707T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS			3.3/5	SMALL OUTLINE	SOP28,.4	Digital Transmission Interfaces	1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
935277002118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G20		1.5 mm	4.4 mm					6.5 mm
UAA2067G/C1	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
CT918B	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
953220640118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2062TS	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	48	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS	.036 mA	3.6 V	3.6	SMALL OUTLINE, SHRINK PITCH	SSOP48,.4	Cordless Telephone ICs	.635 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G48		2.8 mm	7.5 mm	Not Qualified				15.875 mm
SA58640DK,118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
953220640112	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA2079M	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified				8.2 mm
TEA1118M/C2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
TEA1118T-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified	e4			8.65 mm
TEA1118MDK-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
935202550551	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068AHL	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	60 Cel	-10 Cel	Tin (Sn)	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
UAA2068G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V	3.6	FLATPACK, LOW PROFILE, FINE PITCH	QFP32,.28SQ,20	Other Telecom ICs	.5 mm	60 Cel	-10 Cel	TIN	QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified	e3			5 mm
PCD5041H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
PCA5097H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
PCD5091H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
CT918H	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
PCD5092H-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK			.65 mm			TIN	QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified	e3			20 mm
PCD4440T-T	NXP Semiconductors	CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER	OTHER	GULL WING	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		5 V		SMALL OUTLINE			1.27 mm	70 Cel	-25 Cel		DUAL	R-PDSO-G8		2.65 mm	7.5 mm	Not Qualified				7.55 mm
953237450518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
UBA1707TS/C2	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
PCD5091HZ-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm				QUAD	R-PQFP-G100		1.6 mm	14 mm	Not Qualified				14 mm
TEA1118ATD-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5043H	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER	OTHER	GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	.012 mA	3 V	3/5	FLATPACK	QFP64,.7X.95,40	Cordless Telephone ICs	1 mm	70 Cel	-25 Cel		QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified				20 mm
UAA2067GBE	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
TEA1118T/C2	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
CT918B/HM	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT		UNSPECIFIED			UNSPECIFIED	UNSPECIFIED	NO	1					MICROELECTRONIC ASSEMBLY							UNSPECIFIED	X-XXMA-X				Not Qualified
935237440118	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UBA1707T-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2.65 mm	7.5 mm	Not Qualified				17.9 mm
935220650512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			2.9 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
UBA1707TS-T	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL EXTENDED	GULL WING	28	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BICMOS				SMALL OUTLINE			.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G28		2 mm	5.3 mm	Not Qualified				10.2 mm
PCA5097H	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT		GULL WING	100	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			.65 mm				QUAD	R-PQFP-G100		3.2 mm	14 mm	Not Qualified				20 mm
953220650512	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
TEA1118AM	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	16	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.0014 mA	2.9 V	2.9	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP16,.25	Cordless Telephone ICs	.65 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G16		1.5 mm	4.4 mm	Not Qualified				5.2 mm
UAA3515AHL	NXP Semiconductors	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	80 Cel	-20 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified				10 mm
UAA2067G	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	OTHER	GULL WING	32	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	BICMOS		3.6 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-30 Cel		QUAD	S-PQFP-G32		1.6 mm	5 mm	Not Qualified				5 mm
SA58641DK,118	NXP Semiconductors	CORDLESS TELEPHONE SUPPORT CIRCUIT	INDUSTRIAL	GULL WING	20	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			5 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G20	1	1.5 mm	4.4 mm	Not Qualified	e4			6.5 mm
953220650518	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL EXTENDED	GULL WING	14	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		1.6 V		SMALL OUTLINE			1.27 mm	75 Cel	-25 Cel		DUAL	R-PDSO-G14		1.75 mm	3.9 mm	Not Qualified				8.65 mm
PCD5040	NXP Semiconductors	CORDLESS TELEPHONE BURST MODE CONTROLLER		GULL WING	64	QFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS				FLATPACK			1 mm			TIN	QUAD	R-PQFP-G64		3.2 mm	14 mm	Not Qualified	e3			20 mm
UAA2079M-T	NXP Semiconductors	CORDLESS TELEPHONE BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, SHRINK PITCH			.65 mm	70 Cel	-10 Cel		DUAL	R-PDSO-G24		2 mm	5.3 mm	Not Qualified				8.2 mm
TA31137FNG	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR		3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24		1.6 mm	5.6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TA31180FNG	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	COMMERCIAL	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	BIPOLAR	.009 mA	2 V	2	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SSOP24,.3	Cordless Telephone ICs	.65 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G24		1.6 mm	5.6 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	7.8 mm
TA31137FN-TP1	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	OTHER	GULL WING	24	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		5.6 mA	3 V		SMALL OUTLINE, LOW PROFILE, SHRINK PITCH			.65 mm	85 Cel	-30 Cel		DUAL	R-PDSO-G24		1.6 mm	5.6 mm	Not Qualified				7.8 mm
TG2401F	Toshiba	CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT	INDUSTRIAL	GULL WING	20	HTSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1			3 V		SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH			.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	DUAL	R-PDSO-G20		1.04 mm	4.4 mm	Not Qualified	e0			5 mm
TA31103F(ER)	Toshiba	CORDLESS TELEPHONE SUPPORT CIRCUIT	COMMERCIAL	GULL WING	24	SSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1		9.5 mA	3 V		SMALL OUTLINE, SHRINK PITCH			1 mm	70 Cel	-20 Cel		DUAL	R-PDSO-G24		2.2 mm	6 mm	Not Qualified				13 mm

Cordless Phone ICs

Cordless phone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cordless phones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cordless phone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cordless phone, such as making calls and sending messages. They also manage the phone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over the cordless phone's base station and handset. They also provide the ability to switch between different frequency bands and channels.

3. Audio codecs: These ICs are responsible for encoding and decoding audio signals for clear voice communication over the cordless phone.

4. Power management ICs: These ICs manage the power supply and battery life of a cordless phone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

5. Memory ICs: These ICs provide storage for the cordless phone's operating system, contacts, and call history. They include flash memory, RAM, and other types of non-volatile memory.