Cellphone ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Resolution (um) Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Width Qualification Companding Law Input Type Additional Features Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

HPA00452RSTR

Texas Instruments

RF AND BASEBAND CIRCUIT

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

3

.95 mm

4 mm

e4

30

260

4 mm

LMV227SD/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N6

1

.8 mm

2.2 mm

e3

30

260

2.5 mm

TCM320AC56CPT

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.0099 mA

5 V

5

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Codecs

.5 mm

70 Cel

0 Cel

1 dB

QUAD

S-PQFP-G48

1.6 mm

13-BIT

7 mm

Not Qualified

MU-LAW

NOT SPECIFIED

NOT SPECIFIED

7 mm

YES

TRF4903PWRG4

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

.043 mA

2.7 V

2.7

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

LMV225SDX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

UNSPECIFIED

YES

1

1

8 mA

2.7 V

SMALL OUTLINE, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDSO-N6

1

.8 mm

2.2 mm

Not Qualified

e3

30

260

2.5 mm

CC2591RGVTG4

Texas Instruments

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4 mA

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

TRF4400PWRG4

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.075 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

60 Cel

-20 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

GC5016-PB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

252

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.8 V

1.8,3.3

GRID ARRAY

BGA256,16X16,40

Other Telecom ICs

1 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B252

3

2.02 mm

17 mm

Not Qualified

e0

20

220

17 mm

CC2400-RTR1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.005 mA

1.8 V

1.8,1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7 mm

GC5318IZED

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

BALL

388

BGA

SQUARE

PLASTIC/EPOXY

YES

1

1.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B388

3

2.5 mm

27 mm

Not Qualified

e1

30

260

27 mm

LMH2121TME

Texas Instruments

RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CC2591RGVT

Texas Instruments

RF FRONT END CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

4 mA

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC2420Z-RTB1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

1.8,1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N48

3

.9 mm

7 mm

Not Qualified

e4

30

260

7 mm

LMV226UR/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

BALL

VFBGA

SQUARE

UNSPECIFIED

YES

1

1

8 mA

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

TIN SILVER COPPER

BOTTOM

S-XBGA-B4

1

e1

30

260

TCM8000FN

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL EXTENDED

J BEND

44

QCCJ

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

5 V

CHIP CARRIER

1.27 mm

80 Cel

-25 Cel

QUAD

S-PQCC-J44

4.57 mm

16.5862 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

16.5862 mm

TRF4400PW

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.075 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

60 Cel

-20 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

CC2510F32RSPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

TRF6900APT

Texas Instruments

RF AND BASEBAND CIRCUIT

COMMERCIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.05 mA

3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

70 Cel

-20 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

TCM320AC57IDWR

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

12.8 mm

ADS58C23IPFPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

80

HTFQFP

SQUARE

PLASTIC/EPOXY

YES

1

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

QFP80,.55SQ,20

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G80

3

1.2 mm

12 mm

3.45 V

e4

30

260

12 mm

CC1150RGVT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.5 Mbps

S-PQCC-N16

3

1 mm

4 mm

e4

30

260

4 mm

CC1131QRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

AUTOMOTIVE

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1110F16RSP

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

TRF3701IRHC

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,32

Other Telecom ICs

.8 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

TRF370315IRGER

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

24

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

235 mA

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC24,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N24

2

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC1110F8RHH

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

CMOS

3 V

3

CHIP CARRIER

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N36

3

Not Qualified

e4

30

260

TRF3762-EIRHAR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.15 mA

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

CC1070-RTR1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.20SQ,25

Other Telecom ICs

.65 mm

105 Cel

-40 Cel

QUAD

S-XQCC-N20

1 mm

5 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

5 mm

TRF371109IRGZR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

2

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1020RUZR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.27SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

TRF3701CRHCR

Texas Instruments

RF AND BASEBAND CIRCUIT

COMMERCIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

QUAD

S-PQCC-N16

1 mm

4 mm

Not Qualified

4 mm

CC1131IRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.25 Mbps

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

TRF372017IRGZR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.25 mA

3.3 V

3.3,5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

2

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC1131TRHBRG4Q1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

AEC-Q100

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

Other Telecom ICs

.5 mm

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N32

2

1 mm

5 mm

Not Qualified

e4

30

260

5 mm

CC1020RSST

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

.1536 Mbps

S-PQCC-N32

3

1 mm

7 mm

e4

30

260

7 mm

CC1100-RTY1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

MATTE TIN

QUAD

S-XQCC-N20

3

.95 mm

4 mm

Not Qualified

e3

30

260

4 mm

CC1111F8RSPRG3

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

NO LEAD

36

QCCN

SQUARE

PLASTIC/EPOXY

YES

CMOS

3 V

3

CHIP CARRIER

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

0 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N36

3

Not Qualified

e4

30

260

CC1050SK

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

7.8 mm

CC110LRTKT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N20

3

.9 mm

4 mm

e4

30

260

4 mm

TRF370417TDA1

Texas Instruments

RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CC1150-RTY1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC16,.16SQ,25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N16

3

.95 mm

4 mm

Not Qualified

e4

30

260

4 mm

CC1000-RTR1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

28

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.001 mA

3 V

2.5/3.3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP28,.25

Other Telecom ICs

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G28

3

1.2 mm

4.4 mm

Not Qualified

e4

30

260

9.7 mm

CC1110F16RSPG3

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

TRF3710IRGZR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N48

3

1 mm

7 mm

Not Qualified

e4

30

260

7 mm

TRF370417TDA2

Texas Instruments

RF AND BASEBAND CIRCUIT

NOT SPECIFIED

NOT SPECIFIED

CC1050-RTB1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G24

3

1.2 mm

4.4 mm

e4

30

260

7.8 mm

CC1100ERGPT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

20

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

1.8/3.6

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC20,.16SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

.5 Mbps

S-PQCC-N20

3

1 mm

4 mm

Not Qualified

e4

30

260

4 mm

TRF3762-EIRHARG4

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

.15 mA

5 V

5

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N40

3

1 mm

6 mm

Not Qualified

e4

30

260

6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.