Cellphone ICs

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Part RoHS Manufacturer Telecom IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Output Code No. of Channels Technology Screening Level No. of Transceivers Maximum Supply Current Nominal Supply Voltage Power Supplies (V) Package Style (Meter) Package Equivalence Code Sub-Category Terminal Pitch Maximum Operating Temperature Resolution (um) Minimum Operating Temperature Maximum Gain Tolerance Terminal Finish Maximum Output Voltage Terminal Position Data Rate JESD-30 Code Output (V) Moisture Sensitivity Level (MSL) Maximum Seated Height Linear Coding Width Qualification Companding Law Input Type Additional Features Maximum Analog Input JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Filter

TLV321AC36CN

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

3 V

IN-LINE

2.54 mm

70 Cel

0 Cel

DUAL

R-PDIP-T20

5.08 mm

7.62 mm

Not Qualified

24.325 mm

TLV320AC56IDW

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0075 mA

3 V

3

SMALL OUTLINE

SOP20,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1 dB

DUAL

R-PDSO-G20

2.65 mm

13-BIT

7.5 mm

Not Qualified

MU-LAW

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

YES

LMV228URX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

1

e1

30

260

LMV228SDX

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

UNSPECIFIED

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

TIN

DUAL

R-XDSO-N6

1

.8 mm

2.2 mm

Not Qualified

e3

2.5 mm

CC2420RTC

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

1.8,1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N48

3

.9 mm

7 mm

Not Qualified

e4

30

260

7 mm

TCM320AC57CDWR

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

5 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

12.8 mm

TRF6903PT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

2.5/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

TLV320AC56CDWR

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE

1.27 mm

70 Cel

0 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

12.8 mm

TRF6903PTG4

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

2.5/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

TCM8010-37FR

Texas Instruments

BASEBAND CIRCUIT

OTHER

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

4 V

3.7/4

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

-30 Cel

QUAD

S-PQFP-G44

2.25 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TCM4400EPN

Texas Instruments

BASEBAND CIRCUIT

OTHER

GULL WING

80

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.03 mA

3 V

3

FLATPACK

QFP80,.55SQ,20

Other Telecom ICs

.5 mm

85 Cel

-25 Cel

QUAD

S-PQFP-G80

1.6 mm

12 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

12 mm

LMV225UR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B4

1

.425 mm

.975 mm

Not Qualified

e0

40

260

.975 mm

CC2510F8RSPR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

CC2400-STR1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

VQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

1.8 V

1.8,1.8/3.3

CHIP CARRIER, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

7 mm

LMV225TLX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1

8 mA

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B4

1

.675 mm

1.014 mm

Not Qualified

e1

30

260

1.014 mm

TLV320AC57CDW

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0075 mA

3 V

3

SMALL OUTLINE

SOP20,.4

Codecs

1.27 mm

70 Cel

0 Cel

1 dB

DUAL

R-PDSO-G20

2.65 mm

13-BIT

7.5 mm

Not Qualified

A-LAW

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

YES

LMV225TL/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

1

8 mA

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B4

1

.675 mm

1.014 mm

Not Qualified

e1

30

260

1.014 mm

CC2400-RTB1

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

.005 mA

1.8 V

1.8,1.8/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7 mm

TLV321AC37IN

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

THROUGH-HOLE

20

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

3 V

IN-LINE

2.54 mm

85 Cel

-40 Cel

DUAL

R-PDIP-T20

5.08 mm

7.62 mm

Not Qualified

24.325 mm

TLV320AC56DW

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

12.8 mm

TRF5901PTR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.053 mA

3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

TCM4400EPET

Texas Instruments

BASEBAND CIRCUIT

OTHER

GULL WING

80

TFQFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

.03 mA

3 V

3

FLATPACK

TQFP80,.48SQ,16

Other Telecom ICs

.4 mm

85 Cel

-25 Cel

QUAD

S-PQFP-G80

1.2 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

TRF4400PWR

Texas Instruments

RF AND BASEBAND CIRCUIT

OTHER

GULL WING

24

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.075 mA

3 V

3

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP24,.25

Other Telecom ICs

.65 mm

60 Cel

-20 Cel

DUAL

R-PDSO-G24

1.2 mm

4.4 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

7.8 mm

LMH2100TM/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

1

9.2 mA

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.4 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B6

1

.675 mm

.844 mm

e1

30

260

1.244 mm

TLV320AC57IDW

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

.0075 mA

3 V

3

SMALL OUTLINE

SOP20,.4

Codecs

1.27 mm

85 Cel

-40 Cel

1 dB

DUAL

R-PDSO-G20

2.65 mm

13-BIT

7.5 mm

Not Qualified

A-LAW

NOT SPECIFIED

NOT SPECIFIED

12.8 mm

YES

TLV321AC37IPT

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

CC2420RGZ

Texas Instruments

RF AND BASEBAND CIRCUIT

NO LEAD

48

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.8 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.27SQ,20

.5 mm

85 Cel

-40 Cel

QUAD

S-XQCC-N48

1 mm

7 mm

7 mm

TLV321AC36IPTR

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

7 mm

LMV226TLX

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B4

1

.675 mm

1.014 mm

Not Qualified

1.014 mm

LMH9126IRRLR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

12

HQCCN

SQUARE

PLASTIC/EPOXY

YES

1

1

3.3 V

CHIP CARRIER, HEAT SINK/SLUG

105 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-XQCC-N12

2

e4

30

260

TLV320AC57IDWR

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

20

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3 V

SMALL OUTLINE

1.27 mm

85 Cel

-40 Cel

DUAL

R-PDSO-G20

2.65 mm

7.5 mm

Not Qualified

12.8 mm

TLV320AC56PT

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

HPA01083RGVR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

16

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

3 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQCC-N16

2

1 mm

4 mm

e4

30

260

4 mm

LMV226URX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

TIN SILVER COPPER

1

e1

30

260

GC5018IZDL

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

305

BGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1.5 V

GRID ARRAY

1 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B305

3

2.02 mm

19 mm

Not Qualified

e1

30

260

19 mm

LMV225SD/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

UNSPECIFIED

YES

1

1

8 mA

2.7 V

SMALL OUTLINE, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-XDSO-N6

1

.8 mm

2.2 mm

Not Qualified

e3

30

260

2.5 mm

TLV320AC57PT

Texas Instruments

BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

3 V

FLATPACK, LOW PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

QUAD

S-PQFP-G48

1.6 mm

7 mm

Not Qualified

7 mm

TRF5901PTG4

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

.053 mA

3 V

3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

LMV227SDX/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

6

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

2.7 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.65 mm

85 Cel

-40 Cel

MATTE TIN

DUAL

R-PDSO-N6

1

.8 mm

2.2 mm

e3

30

260

2.5 mm

CC2510F16RHHR

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

QUAD

S-PQCC-N36

3

1 mm

6 mm

Not Qualified

e4

NOT SPECIFIED

260

6 mm

LMV228TL/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

VFBGA

RECTANGULAR

UNSPECIFIED

YES

1

1

8 mA

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B4

1

e1

30

260

CC2510F8RSP

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

LMV225URX

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

BALL

4

VFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2.7 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B4

1

.425 mm

.975 mm

Not Qualified

e0

40

260

.975 mm

TCM8010-50FR

Texas Instruments

BASEBAND CIRCUIT

COMMERCIAL

GULL WING

44

QFP

SQUARE

PLASTIC/EPOXY

YES

1

BICMOS

5 V

5

FLATPACK

QFP44,.5SQ,32

Other Telecom ICs

.8 mm

70 Cel

0 Cel

QUAD

S-PQFP-G44

2.25 mm

10 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

10 mm

LMH6523SQ/NOPB

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

54

HVQCCN

RECTANGULAR

UNSPECIFIED

YES

1

4

485 mA

5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

.5 mm

85 Cel

-40 Cel

25.74 dB

MATTE TIN

QUAD

R-XQCC-N54

2

.8 mm

5.5 mm

e3

30

260

10 mm

HPA00471RUZR

Texas Instruments

RF AND BASEBAND CIRCUIT

NICKEL PALLADIUM GOLD

3

e4

30

260

TRF6901PT

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

GULL WING

48

LFQFP

SQUARE

PLASTIC/EPOXY

YES

1

.04 mA

2.7 V

2/3.3

FLATPACK, LOW PROFILE, FINE PITCH

QFP48,.35SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-PQFP-G48

1

1.6 mm

7 mm

Not Qualified

e4

30

260

7 mm

CC2510F32RSPG3

Texas Instruments

RF AND BASEBAND CIRCUIT

INDUSTRIAL

NO LEAD

36

HVQCCN

SQUARE

UNSPECIFIED

YES

1

CMOS

3 V

2.5/3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC36,.25SQ,20

Other Telecom ICs

.5 mm

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

S-XQCC-N36

3

.9 mm

6 mm

Not Qualified

e4

30

260

6 mm

Cellphone ICs

Cellphone ICs (Integrated Circuits) are the electronic components that provide the processing power and functionality for modern cellphones. They are responsible for a wide range of functions, including signal processing, data storage, and communication protocols.

Some common types of cellphone ICs include:

1. Baseband processors: These ICs are responsible for handling the core functions of a cellphone, such as making calls and sending messages. They also manage the cellphone's power consumption and system resources.

2. Radio frequency (RF) transceivers: These ICs are responsible for transmitting and receiving RF signals over cellular networks. They also provide the ability to switch between different network bands and frequencies.

3. Power management ICs: These ICs manage the power supply and battery life of a cellphone. They regulate voltage and current to ensure efficient operation and prevent damage to the device.

4. Memory ICs: These ICs provide storage for the cellphone's operating system, applications, and user data. They include flash memory, RAM, and other types of non-volatile memory.

5. Sensor ICs: These ICs provide sensing capabilities, such as accelerometers, gyroscopes, and proximity sensors. They enable the cellphone to detect motion, orientation, and other environmental conditions.