Other Function Logic ICs

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	No. of Bits	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Count Direction	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	Minimum fmax	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Output Polarity	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
HMC848LC5	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BICMOS				3.3	3.3		CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20			Decoder/Drivers	.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V		e4			5 mm	848
HMC848LC5TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BICMOS			TR	3.3	3.3		CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20			Decoder/Drivers	.5 mm	85 Cel			-40 Cel		QUAD		S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V					5 mm	848
SN74AUP1G99DCUT	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	8	VSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	TSSOP8,.12,20		4 Amp	Gates	.5 mm	85 Cel		3-STATE	-40 Cel	Matte Tin (Sn)	DUAL		R-PDSO-G8	1	3.6 V	.9 mm	2 mm	Not Qualified	TRUE	.8 V		e3	NOT SPECIFIED	260	2.3 mm	AUP/ULP/V
CD4047AK	General Electric Solid State
HMC847LC5TR	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	32	HQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1	BICMOS	4		TR	3.3	3.3		CHIP CARRIER, HEAT SINK/SLUG	LCC32,.2SQ,20			Multiplexer/Demultiplexers	.5 mm	85 Cel			-40 Cel		QUAD		S-CQCC-N32		3.47 V	1.12 mm	5 mm	Not Qualified		3.13 V			NOT SPECIFIED	NOT SPECIFIED	5 mm	847
HMC850LC3	Analog Devices	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	16	HVQCCN	SQUARE	CERAMIC, METAL-SEALED COFIRED		YES	1								CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE					.5 mm	85 Cel			-40 Cel	GOLD OVER NICKEL	QUAD		S-CQCC-N16	3		.92 mm	3 mm					e4	30	260	3 mm	850
NC7SP58L6X	Onsemi	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS			TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20		.5 Amp	Gates	.5 mm	85 Cel			-40 Cel	GOLD NICKEL	DUAL		R-XDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V		e4	30	260	1.45 mm	P
NC7SP58P6X	Onsemi	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		.5 Amp	Gates	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.9 V		e4	30	260	2 mm	P
SN74LS628N	Texas Instruments	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	14	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	1	TTL		1	TUBE	5			IN-LINE		15 ns	24 Amp		2.54 mm	70 Cel			0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T14	1	5.25 V	5.08 mm	7.62 mm	Not Qualified	COMPLEMENTARY	4.75 V	55 mA	e4			19.305 mm	LS
SN74LS629N	Texas Instruments	LOGIC CIRCUIT	COMMERCIAL	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	2	TTL		2	TUBE	5			IN-LINE		15 ns	24 Amp		2.54 mm	70 Cel			0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T16	1	5.25 V	5.08 mm	7.62 mm	Not Qualified	COMPLEMENTARY	4.75 V	55 mA	e4			19.305 mm	LS
TPIC6A259DW	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				TUBE	5			SMALL OUTLINE					1.27 mm	125 Cel		OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	5.5 V	2.65 mm	7.5 mm	Not Qualified	INVERTED	4.5 V		e4	30	260	15.4 mm	6A
TPIC6A259DWG4	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				TUBE	5			SMALL OUTLINE					1.27 mm	125 Cel		OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	5.5 V	2.65 mm	7.5 mm	Not Qualified	INVERTED	4.5 V		e4	30	260	15.4 mm	6A
TPIC6A259DWR	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1					5			SMALL OUTLINE					1.27 mm	125 Cel		OPEN-DRAIN	-40 Cel		DUAL		R-PDSO-G24		5.5 V	2.65 mm	7.5 mm	Not Qualified		4.5 V			NOT SPECIFIED	NOT SPECIFIED	15.4 mm	6A
TPIC6A259DWRG4	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	24	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1				TR	5			SMALL OUTLINE					1.27 mm	125 Cel		OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G24	1	5.5 V	2.65 mm	7.5 mm	Not Qualified	INVERTED	4.5 V		e4	30	260	15.4 mm	6A
1520	Data Delay Devices
74LVC1G97GV,125	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSOP6,.11,37		24 Amp	Gates	.95 mm	125 Cel			-40 Cel	TIN	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm	Not Qualified		1.65 V		e3	30	260	2.9 mm	LVC/LCX/Z
SN74LVC1G58DBVRE4	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.8	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP6,.11,37		24 Amp	Gates	.95 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	5.5 V	1.45 mm	1.6 mm	Not Qualified		1.65 V		e4	30	260	2.9 mm	LVC/LCX/Z
SN74LVC1G58DBVRG4	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	LSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.8	3.3	50 pF	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	TSOP6,.11,37		24 Amp	Gates	.95 mm	125 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	5.5 V	1.45 mm	1.6 mm	Not Qualified		1.65 V		e4	30	260	2.9 mm	LVC/LCX/Z
TPIC6259DWG4	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	20	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	1			8	TUBE	5	5		SMALL OUTLINE	SOP20,.4			FF/Latches	1.27 mm	125 Cel		OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G20	1	5.5 V	2.65 mm	7.5 mm	Not Qualified	TRUE	4.5 V		e4	30	260	12.8 mm	6259
74LVC1G57GN,132	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	NO LEAD	6	SON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS				1.8	3.3	50 pF	SMALL OUTLINE	SOLCC6,.04,12		24 Amp	Gates	.3 mm	125 Cel			-40 Cel	TIN	DUAL		R-PDSO-N6	1	5.5 V	.35 mm	.9 mm	Not Qualified		1.65 V		e3	30	260	1 mm	LVC/LCX/Z
74LVC1G98GV,125	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS				2.3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.95 mm	125 Cel			-40 Cel	TIN	DUAL		R-PDSO-G6		5.5 V	1.1 mm	1.5 mm			1.65 V		e3			2.9 mm	LVC/LCX/Z
MC14490FG	Onsemi	LOGIC CIRCUIT	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		4		5	5/15		SMALL OUTLINE	SOP16,.3	740 ns		Other Logic ICs	1.27 mm	125 Cel	RIGHT		-55 Cel	NICKEL PALLADIUM GOLD	DUAL	4.5 MHz	R-PDSO-G16	3	18 V	2.05 mm	5.275 mm	Not Qualified	TRUE	3 V		e4	30	260	10.2 mm	4000/14000/40000
MC14490P	Onsemi	LOGIC CIRCUIT	MILITARY	THROUGH-HOLE	16	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	6	CMOS		4		5	5/15		IN-LINE	DIP16,.3	740 ns		Other Logic ICs	2.54 mm	125 Cel	RIGHT		-55 Cel	Tin/Lead (Sn/Pb)	DUAL	4.5 MHz	R-PDIP-T16		18 V	4.44 mm	7.62 mm	Not Qualified	TRUE	3 V		e0	30	235	19.175 mm	4000/14000/40000
NC7SV57FHX-L22780	Onsemi	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.1	1.2/3.3	15 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14		2 Amp	Gates	.35 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL		S-PDSO-N6		3.6 V	.55 mm	1 mm	Not Qualified		.9 V		e4			1 mm	AUP/ULP/V
NLX1G99DMUTWG	Onsemi	LOGIC CIRCUIT	MILITARY	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS				1.8			SMALL OUTLINE, VERY THIN PROFILE					.5 mm	125 Cel		3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N8	1	5.5 V	.55 mm	1 mm			1.65 V		e4	30	260	1.95 mm	1G
SN74LVC1G58DRLRG4	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	FLAT	6	VSOF	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.8	3.3	50 pF	SMALL OUTLINE, VERY THIN PROFILE	FL6,.047,20		24 Amp	Gates	.5 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-F6	1	5.5 V	.6 mm	1.2 mm	Not Qualified		1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
TPIC6259N	Texas Instruments	LOGIC CIRCUIT	AUTOMOTIVE	THROUGH-HOLE	20	DIP	RECTANGULAR	PLASTIC/EPOXY		NO	1			8	TUBE	5	5		IN-LINE	DIP20,.3			FF/Latches	2.54 mm	125 Cel		OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDIP-T20		5.5 V	5.08 mm	7.62 mm	Not Qualified	TRUE	4.5 V		e4			25.4 mm	6259
632-10	Datatronics
74AHC1G4210GWH	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			TR, 7 INCH	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.65 mm	125 Cel			-40 Cel		DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm			2 V			30	260	2.05 mm	AHC/VHC/H/U/V
74AUP1G97GW,125	NXP Semiconductors	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.1	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		1.7 Amp	Gates	.65 mm	125 Cel			-40 Cel	Tin (Sn)	DUAL		R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.8 V		e3	30	260	2 mm	AUP/ULP/V
74AUP1T97L6X	Onsemi	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	2.5	2.5/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20		3.1 Amp	Gates	.5 mm	85 Cel			-40 Cel	NICKEL PALLADIUM	DUAL		R-PDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		2.3 V		e4	30	260	1.45 mm	AUP/ULP/V
CD74HC670M	Texas Instruments	LOGIC CIRCUIT	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS		4	TUBE	4.5			SMALL OUTLINE		42 ns	7.8 Amp		1.27 mm	125 Cel		3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	6 V	1.75 mm	3.9 mm	Not Qualified	TRUE	2 V	.08 mA	e4	30	260	9.9 mm	HC/UH
MC14490DW	Onsemi	LOGIC CIRCUIT	MILITARY	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	6	CMOS		4		5	5/15		SMALL OUTLINE	SOP16,.4	740 ns		Other Logic ICs	1.27 mm	125 Cel	RIGHT		-55 Cel	Tin/Lead (Sn85Pb15)	DUAL	4.5 MHz	R-PDSO-G16		18 V	2.65 mm	7.5 mm	Not Qualified	TRUE	3 V		e0	30	235	10.3 mm	4000/14000/40000
NC7SP57L6X	Onsemi	LOGIC CIRCUIT	INDUSTRIAL	NO LEAD	6	VSON	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS			TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,20		.5 Amp	Gates	.5 mm	85 Cel			-40 Cel	GOLD NICKEL	DUAL		R-XDSO-N6	1	3.6 V	.55 mm	1 mm	Not Qualified		.9 V		e4	30	260	1.45 mm	P
NC7SV57P6X	Onsemi	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.1	1.2/3.3	15 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		2 Amp	Gates	.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.9 V		e4	30	260	2 mm	AUP/ULP/V
NL7SZ98DBVT1G	Onsemi	LOGIC CIRCUIT	MILITARY	GULL WING	6	TSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			TR	3.3			SMALL OUTLINE, THIN PROFILE	TSOP6,.11,37				.95 mm	125 Cel			-55 Cel	MATTE TIN	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.5 mm			1.65 V		e3	30	260	3 mm	LVC/LCX/Z
NLX1G99AMX1TCG	Onsemi	LOGIC CIRCUIT	MILITARY	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	2.5	1.8/5	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20		8 Amp	Gates	.5 mm	125 Cel		3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N8	1	5.5 V	.55 mm	1 mm	Not Qualified		1.65 V		e4		260	1.95 mm	1G
NLX1G99DMUTCG	Onsemi	LOGIC CIRCUIT	MILITARY	NO LEAD	8	VSON	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	2.5	1.8/5	30 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC8,.04,20		8 Amp	Gates	.5 mm	125 Cel		3-STATE	-55 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-N8	1	5.5 V	.55 mm	1 mm	Not Qualified		1.65 V		e4	30	260	1.95 mm	1G
NTE74LS48	Nte Electronics
PCA9641PWJ	NXP Semiconductors	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	16	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			TR, 13 INCH	3			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.65 mm	85 Cel			-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	3.6 V	1.1 mm	4.4 mm			2.3 V		e4	30	260	5 mm	9641
SN74AUP1G57DCKRG4	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		1.7 Amp	Gates	.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.8 V		e4	30	260	2 mm	AUP/ULP/V
SN74AUP1G58DCKTE4	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.2	1.2/3.3	30 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		1.7 Amp	Gates	.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	3.6 V	1.1 mm	1.25 mm	Not Qualified		.8 V		e4	30	260	2 mm	AUP/ULP/V
SN74LS629D	Texas Instruments	LOGIC CIRCUIT	COMMERCIAL	GULL WING	16	SOP	RECTANGULAR	PLASTIC/EPOXY		YES	2	TTL		2	TUBE	5			SMALL OUTLINE		15 ns	24 Amp		1.27 mm	70 Cel			0 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G16	1	5.25 V	1.75 mm	3.9 mm	Not Qualified	COMPLEMENTARY	4.75 V	55 mA	e4	30	260	9.9 mm	LS
SN74LVC1G97YZPR	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	1	CMOS	3		TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	16.4 ns	32 Amp	Gates	.5 mm	85 Cel		3-STATE	-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-XBGA-B6	1	5.5 V	.5 mm	.9 mm	Not Qualified		1.65 V	.01 mA	e1	NOT SPECIFIED	260	1.4 mm	LVC/LCX/Z
SN74LVC1G98DCKRG4	Texas Instruments	LOGIC CIRCUIT	INDUSTRIAL	GULL WING	6	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS			TR	1.8	3.3	50 pF	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP6,.08		24 Amp	Gates	.65 mm	85 Cel		3-STATE	-40 Cel	NICKEL PALLADIUM GOLD	DUAL		R-PDSO-G6	1	5.5 V	1.1 mm	1.25 mm	Not Qualified		1.65 V		e4	30	260	2 mm	LVC/LCX/Z
609-5	Datatronics
74AHC1G4212GWH	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			TR, 7 INCH	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.65 mm	125 Cel			-40 Cel		DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm			2 V			30	260	2.05 mm	AHC/VHC/H/U/V
74AHC1G4214GWH	Nexperia	LOGIC CIRCUIT	AUTOMOTIVE	GULL WING	5	TSSOP	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS			TR, 7 INCH	5			SMALL OUTLINE, THIN PROFILE, SHRINK PITCH					.65 mm	125 Cel			-40 Cel		DUAL		R-PDSO-G5	1	5.5 V	1.1 mm	1.25 mm			2 V			30	260	2.05 mm	AHC/VHC/H/U/V

Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.

Some of the commonly used other function logic ICs include:

1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.

3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.

5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.

Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.