Other Function Logic ICs
| Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Maximum Frequency At Nominal Supply | Technology | Screening Level | No. of Inputs | No. of Bits | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Count Direction | Output Characteristics | Trigger Type | Minimum Operating Temperature | Terminal Finish | Terminal Position | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
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Renesas Electronics |
LOGIC CIRCUIT |
INDUSTRIAL |
GULL WING |
6 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
TR |
1.8 |
3.3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP6,.08 |
6 Amp |
Logic IC:Other |
.65 mm |
85 Cel |
-40 Cel |
TIN BISMUTH |
DUAL |
R-PDSO-G6 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
1.65 V |
e6 |
2 mm |
LV/LV-A/LVX/H |
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Renesas Electronics |
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Renesas Electronics |
INDUSTRIAL |
GULL WING |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.3,20 |
Other Logic ICs |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
1 |
Not Qualified |
e0 |
20 |
240 |
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Renesas Electronics |
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Renesas Electronics |
LOGIC CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
1.65 V |
1.4 mm |
LVC/LCX/Z |
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Renesas Electronics |
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Renesas Electronics |
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Renesas Electronics |
INDUSTRIAL |
GULL WING |
56 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
CMOS |
3.3 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP56,.25,16 |
Other Logic ICs |
.4 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
R-PDSO-G56 |
1 |
Not Qualified |
e0 |
30 |
240 |
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Renesas Electronics |
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Renesas Electronics |
NOT SPECIFIED |
NOT SPECIFIED |
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Renesas Electronics |
LOGIC CIRCUIT |
INDUSTRIAL |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-PBGA-B6 |
5.5 V |
.5 mm |
.9 mm |
Not Qualified |
1.65 V |
1.4 mm |
LVC/LCX/Z |
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Renesas Electronics |
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Renesas Electronics |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N12 |
3.6 V |
.8 mm |
2.5 mm |
3 V |
TWO DIFFRENT FUCTION AND AND OR FUCTION |
NOT SPECIFIED |
NOT SPECIFIED |
2.5 mm |
4180 |
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|
Renesas Electronics |
LOGIC CIRCUIT |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
3.3 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N12 |
3.6 V |
.8 mm |
2.5 mm |
3 V |
TWO DIFFRENT FUCTION AND AND OR FUCTION |
2.5 mm |
4180 |
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Broadcom |
COMMERCIAL |
THROUGH-HOLE |
40 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
MOS |
5 |
5 |
IN-LINE |
DIP40,.6 |
Other Logic ICs |
2.54 mm |
70 Cel |
0 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-PDIP-T40 |
Not Qualified |
e0 |
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Broadcom |
LOGIC CIRCUIT |
BALL |
127 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.8 |
GRID ARRAY |
BOTTOM |
S-PBGA-B127 |
1 |
Not Qualified |
8124 |
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Micron Technology |
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Micron Technology |
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Micron Technology |
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Micron Technology |
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Micron Technology |
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Micron Technology |
Other function logic ICs are electronic circuits that perform various logic functions beyond the basic logic gates and flip-flops. These ICs are designed to perform specific functions, such as encoding, decoding, multiplexing, demultiplexing, and signal conditioning.
Some of the commonly used other function logic ICs include:
1. Encoders: Encoders are digital circuits that convert a set of input signals into a coded output. They are commonly used in digital systems to encode data for transmission or storage. Encoders can be designed using various technologies, including TTL, CMOS, and FPGAs.
2. Decoders: Decoders are digital circuits that convert a coded input into a set of output signals. They are commonly used in digital systems to decode data for processing or display. Decoders can be designed using various technologies, including TTL, CMOS, and FPGAs.
3. Multiplexers: Multiplexers, also known as MUXs, are digital circuits that can select one of several input signals and transmit it to a single output line based on a control signal. They are commonly used in digital systems to reduce the number of transmission lines required to transmit multiple signals. Multiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.
4. Demultiplexers: Demultiplexers, also known as DEMUXs, are digital circuits that can distribute a single input signal to one of several output lines based on a control signal. They are commonly used in digital systems to receive multiple signals transmitted over a single line. Demultiplexers can be designed using various technologies, including TTL, CMOS, and FPGAs.
5. Comparators: Comparators are digital circuits that compare two input signals and produce a binary output signal indicating the relationship between the two inputs. They are commonly used in digital systems to compare digital values for control and decision-making purposes. Comparators can be designed using various technologies, including TTL, CMOS, and FPGAs.
Other function logic ICs are used in various applications, including digital signal processing, telecommunications, and data storage systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.