Xilinx - XCZU9EG-1FFVB1156I

XCZU9EG-1FFVB1156I by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XCZU9EG-1FFVB1156I
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;
Datasheet XCZU9EG-1FFVB1156I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: .85 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: .876 V
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Terminals: 1156
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B1156
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 100 Cel
Peak Reflow Temperature (C): 245
Package Code: BGA
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 4
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products