Xilinx - XCZU4CG-1FBVB900I

CY8C4247LQI-BL483 by Infineon is a PROGRAMMABLE SoC with NICKEL PALLADIUM GOLD finish. It can withstand peak reflow temp of 260°C for 30s, suitable for INDUSTRIAL applications. MSL level of 3 makes it ideal for Other Function uPs,uCs & Peripheral ICs.

SYSTEM ON CHIP;

SoC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 72; Package Code: HVQCCN; Package Shape: SQUARE;

ESP32-WROOM-32UE-N8 by Espressif Systems is a SoC with 38 terminals, operating at 3.3V nominal voltage and 85°C max temp. Ideal for IoT applications due to its CMOS technology, compact size (19.2mm x 18mm), and surface mount capability.

NRF52832-QFAA-R7 by Nordic Semiconductor Asa is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.7-3.6 V. Ideal for applications requiring low-profile, surface-mountable chips in various electronic devices.

XC7Z100-2FFG900I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;

The NXP Semiconductors MIMX8MM3CVTKZAA is a SoC with 486 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 0.9V to 1V and uses CMOS technology. This low-profile, fine-pitch IC is suitable for applications requiring high performance in compact spaces.

EFR32MG24A021F1024IM40-B by Silicon Labs is a 40-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

Other uPs/uCs/Peripheral ICs;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; Package Code: BGA; Package Shape: UNSPECIFIED; Package Style (Meter): GRID ARRAY; Technology: CMOS;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 485; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

XCZU9CG-1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

EFR32MG24B310F1536IM48-B by Silicon Labs is a 48-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 3.8V. Ideal for applications requiring low-profile, surface-mount chips in various electronic devices.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; Length: 21.72 mm;

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;