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Manufacturer | Xilinx |
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Manufacturer's Part Number | XCKU3P-1FFVD900E |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | XCKU3P-1FFVD900E Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .825 V |
Package Body Material: | PLASTIC/EPOXY |
Organization: | 20340 CLBS |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.42 mm |
No. of Inputs: | 304 |
Surface Mount: | YES |
No. of Outputs: | 304 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 900 |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B900 |
Package Shape: | SQUARE |
Maximum Operating Temperature: | 100 Cel |
Package Code: | BGA |
Width: | 31 mm |
Moisture Sensitivity Level (MSL): | 4 |
Grading Of Temperature: | OTHER |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | .876 V |
Nominal Supply Voltage (V): | 0.85 |
No. of Logic Cells: | 355950 |
No. of CLBs: | 20340 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Package Equivalence Code: | BGA900,30X30,40 |
Finishing Of Terminal Used: | TIN SILVER COPPER |
Length: | 31 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 245 |