Xilinx - XCKU3P-1FFVD900E

XCKU3P-1FFVD900E by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU3P-1FFVD900E
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU3P-1FFVD900E Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .825 V
Package Body Material: PLASTIC/EPOXY
Organization: 20340 CLBS
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 3.42 mm
No. of Inputs: 304
Surface Mount: YES
No. of Outputs: 304
Position Of Terminal: BOTTOM
No. of Terminals: 900
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: OTHER
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: .876 V
Nominal Supply Voltage (V): 0.85
No. of Logic Cells: 355950
No. of CLBs: 20340
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 31 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245
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