Xilinx - XCKU035-2FBVA900I

XCKU035-2FBVA900I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCKU035-2FBVA900I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
Datasheet XCKU035-2FBVA900I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .922 V
Package Body Material: PLASTIC/EPOXY
Organization: 1700 CLBS
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.8 mm
No. of Inputs: 520
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 520
Position Of Terminal: BOTTOM
No. of Terminals: 900
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B900
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 31 mm
Moisture Sensitivity Level (MSL): 4
Grading Of Temperature: INDUSTRIAL
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: .979 V
Nominal Supply Voltage (V): .95
No. of Logic Cells: 444343
No. of CLBs: 1700
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA900,30X30,40
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 31 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 245
Power Supplies (V): 0.95
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