Xilinx - XCF02SVOG20C

XCF02SVOG20C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XCF02SVOG20C
Description CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
Datasheet XCF02SVOG20C Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .001 Amp
Organization: 2MX1
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.19 mm
Minimum Supply Voltage (Vsup): 3 V
Sub-Category: Flash Memories
Surface Mount: YES
Maximum Supply Current: 10 mA
Terminal Finish: Matte Tin (Sn)
No. of Terminals: 20
No. of Words: 2097152 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Technology: CMOS
JESD-30 Code: R-PDSO-G20
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Endurance: 20000 Write/Erase Cycles
Package Code: TSSOP
Width: 4.4 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 2097152 bit
Memory IC Type: CONFIGURATION MEMORY
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 1
No. of Functions: 1
Type: NOR TYPE
Qualification: Not Qualified
Package Equivalence Code: TSSOP20,.25
Length: 6.5024 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
Minimum Data Retention Time: 20
Peak Reflow Temperature (C): 260
Parallel or Serial: SERIAL
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
Power Supplies (V): 1.8/3.3,3.3
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