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Manufacturer | Xilinx |
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Manufacturer's Part Number | XC7S6-1CPGA196I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE; |
Datasheet | XC7S6-1CPGA196I Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Organization: | 469 CLBS |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Combinatorial Delay of a CLB: | 1.27 ns |
Maximum Seated Height: | 1.1 mm |
No. of Inputs: | 100 |
Surface Mount: | YES |
No. of Outputs: | 100 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 196 |
Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
JESD-30 Code: | S-PBGA-B196 |
Maximum Clock Frequency: | 1098 MHz |
Package Shape: | SQUARE |
Maximum Operating Temperature: | 100 Cel |
Package Code: | TFBGA |
Width: | 8 mm |
Grading Of Temperature: | INDUSTRIAL |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Maximum Supply Voltage: | 1.05 V |
Nominal Supply Voltage (V): | 1 |
No. of Logic Cells: | 6000 |
No. of CLBs: | 469 |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA196,14X14,20 |
Finishing Of Terminal Used: | TIN SILVER COPPER |
Length: | 8 mm |
Form Of Terminal: | BALL |
Pitch Of Terminal: | .5 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |