![XC7K325T-1FB676I by Xilinx XC7K325T-1FB676I by Xilinx](https://partstack.com/mpn/images/200/113675513.webp)
Image shown is a representation only.
Manufacturer | Xilinx |
---|---|
Manufacturer's Part Number | XC7K325T-1FB676I |
Description | FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 1818 MHz; |
Datasheet | XC7K325T-1FB676I Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
No. of Inputs: | 400 |
Sub-Category: | Field Programmable Gate Arrays |
Surface Mount: | YES |
No. of Outputs: | 400 |
Position Of Terminal: | BOTTOM |
No. of Terminals: | 676 |
Package Style (Meter): | GRID ARRAY |
JESD-30 Code: | S-PBGA-B676 |
Maximum Clock Frequency: | 1818 MHz |
Package Shape: | SQUARE |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 4 |
Programmable IC Type: | FIELD PROGRAMMABLE GATE ARRAY |
Technology Used: | CMOS |
No. of Logic Cells: | 326080 |
JESD-609 Code: | e0 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA676,26X26,40 |
Finishing Of Terminal Used: | TIN LEAD |
Form Of Terminal: | BALL |
Pitch Of Terminal: | 1 mm |
Peak Reflow Temperature (C): | 225 |
Power Supplies (V): | 1,1.8,3.3 |