Xilinx - XC7A200T-1FBG676I

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XC7A200T-1FBG676I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC7A200T-1FBG676I
Description FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of Inputs: 400;
Datasheet XC7A200T-1FBG676I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Organization: 16825 CLBS
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Combinatorial Delay of a CLB: 1.27 ns
Maximum Seated Height: 2.54 mm
No. of Inputs: 400
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 400
Position Of Terminal: BOTTOM
No. of Terminals: 676
Package Style (Meter): GRID ARRAY
JESD-30 Code: S-PBGA-B676
Maximum Clock Frequency: 1098 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: BGA
Width: 27 mm
Moisture Sensitivity Level (MSL): 4
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.05 V
Nominal Supply Voltage (V): 1
Technology Used: CMOS
No. of Logic Cells: 215360
No. of CLBs: 16825
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA676,26X26,40
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 27 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 250
Power Supplies (V): 1
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