Xilinx - XC6SLX4-2CSG225I

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XC6SLX4-2CSG225I by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC6SLX4-2CSG225I
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet XC6SLX4-2CSG225I Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Organization: 300 CLBS
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Combinatorial Delay of a CLB: .26 ns
Maximum Seated Height: 1.4 mm
No. of Inputs: 120
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 120
Position Of Terminal: BOTTOM
No. of Terminals: 225
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
JESD-30 Code: S-PBGA-B225
Maximum Clock Frequency: 667 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 100 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: INDUSTRIAL
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 3840
No. of CLBs: 300
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA225,15X15,32
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 13 mm
Form Of Terminal: BALL
Pitch Of Terminal: .8 mm
Peak Reflow Temperature (C): 260
Power Supplies (V): 1.2,2.5/3.3
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