Xilinx - XC3S400A-4FTG256C

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XC3S400A-4FTG256C by Xilinx

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Manufacturer Xilinx
Manufacturer's Part Number XC3S400A-4FTG256C
Description FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
Datasheet XC3S400A-4FTG256C Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.14 V
Package Body Material: PLASTIC/EPOXY
Organization: 896 CLBS, 400000 GATES
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Combinatorial Delay of a CLB: .71 ns
Maximum Seated Height: 1.55 mm
No. of Inputs: 195
Sub-Category: Field Programmable Gate Arrays
Surface Mount: YES
No. of Outputs: 160
Position Of Terminal: BOTTOM
No. of Terminals: 256
No. of Equivalent Gates: 400000
Package Style (Meter): GRID ARRAY, LOW PROFILE
JESD-30 Code: S-PBGA-B256
Maximum Clock Frequency: 667 MHz
Package Shape: SQUARE
Maximum Operating Temperature: 85 Cel
Package Code: LBGA
Width: 17 mm
Moisture Sensitivity Level (MSL): 3
Grading Of Temperature: OTHER
Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY
Maximum Supply Voltage: 1.26 V
Nominal Supply Voltage (V): 1.2
Technology Used: CMOS
No. of Logic Cells: 8064
No. of CLBs: 896
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA256,16X16,40
Finishing Of Terminal Used: TIN SILVER COPPER
Length: 17 mm
Form Of Terminal: BALL
Pitch Of Terminal: 1 mm
Peak Reflow Temperature (C): 260
Power Supplies (V): 1.2,2.5/3.3
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