Winbond Electronics - W631GU6NB11I

W631GU6NB11I by Winbond Electronics

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Manufacturer Winbond Electronics
Manufacturer's Part Number W631GU6NB11I
Description DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B96;
Datasheet W631GU6NB11I Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .055 Amp
Organization: 64MX16
Output Characteristics: 3-STATE
Maximum Seated Height: 1 mm
Access Mode: MULTI BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.283 V
Surface Mount: YES
Maximum Supply Current: 240 mA
No. of Terminals: 96
Maximum Clock Frequency (fCLK): 933 MHz
No. of Words: 67108864 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B96
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 95 Cel
Package Code: VFBGA
Width: 7.5 mm
Input/Output Type: COMMON
No. of Ports: 1
Memory Density: 1073741824 bit
Self Refresh: YES
Sequential Burst Length: 8
Memory IC Type: DDR3L DRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 16
No. of Functions: 1
Package Equivalence Code: BGA96,9X16,32
Interleaved Burst Length: 8
Length: 13 mm
Maximum Access Time: 20 ns
No. of Words Code: 64M
Nominal Supply Voltage / Vsup (V): 1.35
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.45 V
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