Winbond Electronics - W25Q64FVSSIG

W25Q64FVSSIG by Winbond Electronics

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Manufacturer Winbond Electronics
Manufacturer's Part Number W25Q64FVSSIG
Description FLASH; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: SQUARE; Maximum Standby Current: .00005 Amp;
Datasheet W25Q64FVSSIG Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00005 Amp
Organization: 8MX8
Output Characteristics: 3-STATE
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 2.16 mm
Minimum Supply Voltage (Vsup): 3 V
Surface Mount: YES
Terminal Finish: MATTE TIN
No. of Terminals: 8
Maximum Clock Frequency (fCLK): 104 MHz
No. of Words: 8388608 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Write Protection: HARDWARE/SOFTWARE
Technology: CMOS
JESD-30 Code: S-PDSO-G8
Package Shape: SQUARE
Terminal Form: GULL WING
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: SOP
Width: 5.28 mm
Moisture Sensitivity Level (MSL): 3
Serial Bus Type: SPI
Memory Density: 67108864 bit
Memory IC Type: FLASH
JESD-609 Code: e3
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOP8,.3
Alternate Memory Width: 1
Length: 5.28 mm
No. of Words Code: 8M
Minimum Data Retention Time: 20
Peak Reflow Temperature (C): 260
Parallel or Serial: SERIAL
Terminal Pitch: 1.27 mm
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 3.6 V
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