U-blox Ag - RCB-F9T-0

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 50; Peak Reflow Temperature (C): 250;

TELECOM CIRCUIT;

MCP2140-I/SO by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Small outline package for telecom circuits, operates b/w -40 to 85°C. Ideal for industrial applications requiring TS 16949 screening level.

Silicon Labs' WT12-A-AI4 is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 31 terminals. Operating from -40 to 85 °C, it's ideal for INDUSTRIAL applications requiring TELECOM CIRCUIT ICs at 3.3 V supply voltage and 1.5 mm terminal pitch.

CC1120RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps, suitable for telecom circuits in industrial applications. This surface-mount chip carrier package measures 5x5mm with a very thin profile, making it ideal for compact designs.

BMD-340-A-R by U-blox Ag is a surface mount telecom IC with a data rate of 2 Mbps. It operates in industrial temperature range (-40 to 85°C) and has MSL level 3. Ideal for applications requiring high-speed data transmission in harsh environments.

PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;

SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.

CC2640R2FTWRGZTQ1 by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 105°C, has a data rate of 1 Mbps, and requires a nominal voltage of 3V. Ideal for industrial applications requiring reliable communication at high speeds in compact spaces.

NRF24L01P-R by Nordic Semiconductor Asa is a 20-terminal telecom IC with 3V supply voltage, operating from -40 to 85°C. It comes in a square chip carrier package and is surface-mountable. Ideal for industrial applications requiring wireless communication at peak reflow temp of 260°C.

STMicroelectronics MP45DT02TR-M is a telecom IC with 6 terminals, operating b/w -30 to 85°C. It has a rectangular shape, grid array package style, and nickel palladium gold finish. With a nominal voltage of 1.8V, it's ideal for telecom circuit applications due to its compact size (4.72mm x 3.76mm) and no-lead terminal form.

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;

TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSSOP; Package Shape: RECTANGULAR;

RN42-I/RM by Microchip Technology is a telecom IC with 35 terminals, operating at -40 to 85°C. It has a data rate of 3 Mbps, suitable for industrial applications requiring a 3.3V supply voltage and surface mount installation in compact spaces.