Image shown is a representation only.
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TLK1102ERGER |
| Description | ATM/SONET/SDH SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | TLK1102ERGER Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | .29 mA |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 24 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| JESD-30 Code: | S-PQCC-N24 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 100 Cel |
| No. of Channels: | 2 |
| Package Code: | HVQCCN |
| Width: | 4 mm |
| Moisture Sensitivity Level (MSL): | 2 |
| Telecom IC Type: | ATM/SONET/SDH SUPPORT CIRCUIT |
| Applications: | SONET |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC24,.16SQ,20 |
| Length: | 4 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3.3 |
