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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TDA2HVBDQABCRQ1 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | TDA2HVBDQABCRQ1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.11 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.15 V |
| Integrated Cache: | NO |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.96 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 760 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| No. of I/O Lines: | 247 |
| Address Bus Width: | 16 |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| RAM Words: | 2.5M |
| JESD-30 Code: | S-PBGA-B760 |
| Maximum Clock Frequency: | 38.4 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | FBGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 500 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.2 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 23 mm |
| Peak Reflow Temperature (C): | 250 |
| Bus Compatibility: | CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | AUTOMOTIVE |
