Texas Instruments - TCM1501BP-00

  1. Home
  2. Texas Instruments - TCM1501BP-00
TCM1501BP-00 by Texas Instruments

Image shown is a representation only.

Manufacturer Texas Instruments
Manufacturer's Part Number TCM1501BP-00
Description TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TCM1501BP-00 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: TELEPHONE RINGER CIRCUIT
Maximum Seated Height: 5.08 mm
Surface Mount: NO
Minimum Operating Temperature: -20 Cel
No. of Functions: 1
No. of Terminals: 8
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
JESD-30 Code: R-PDIP-T8
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Width: 7.62 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

TEA1112AT by NXP Semiconductors

TEA1112AT

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
MT88E39ASR1 by Zarlink Semiconductor

MT88E39ASR1

Zarlink Semiconductor

TELEPHONE CALLING NO IDENTIFICATION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
KS58531 by Samsung

KS58531

Samsung

TELEPHONE DIALER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
KS5851N by Samsung

KS5851N

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3344T/011 by NXP Semiconductors

PCD3344T/011

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
LT1684IN#PBF by Linear Technology

LT1684IN#PBF

Linear Technology

TELEPHONE RINGER CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1112 by NXP Semiconductors

TEA1112

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3311CPN by NXP Semiconductors

PCD3311CPN

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
L3926AD by STMicroelectronics

L3926AD

STMicroelectronics

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
TCM5087DR by Texas Instruments

TCM5087DR

Texas Instruments

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
ML8205AE by STMicroelectronics

ML8205AE

STMicroelectronics

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1065T by NXP Semiconductors

TEA1065T

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
PSB45030-T by Infineon Technologies

PSB45030-T

Infineon Technologies

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
TEA1112T-T by NXP Semiconductors

TEA1112T-T

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
PCD3312PN by NXP Semiconductors

PCD3312PN

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1095TS by NXP Semiconductors

TEA1095TS

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
TC31020P by Toshiba

TC31020P

Toshiba

TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
PCD3321CD-T by NXP Semiconductors

PCD3321CD-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
MT88E39AS1 by Microsemi

MT88E39AS1

Microsemi

TELEPHONE CALLING NO IDENTIFICATION CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
KS58B23N by Samsung

KS58B23N

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;