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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TBP38SA16XFK |
| Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: QCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; |
| Datasheet | TBP38SA16XFK Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Organization: | 2KX8 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Sub-Category: | OTP ROMs |
| Surface Mount: | YES |
| No. of Terminals: | 28 |
| No. of Words: | 2048 words |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER |
| Technology: | TTL |
| JESD-30 Code: | S-XQCC-N28 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | QCCN |
| Memory Density: | 16384 bit |
| Memory IC Type: | OTP ROM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LCC28,.45SQ |
| No. of Words Code: | 2K |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | COMMERCIAL |
