Texas Instruments - TBP24SA81-55N

TBP24SA81-55N by Texas Instruments

Image shown is a representation only.

Manufacturer Texas Instruments
Manufacturer's Part Number TBP24SA81-55N
Description OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
Datasheet TBP24SA81-55N Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2KX4
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Sub-Category: OTP ROMs
Surface Mount: NO
No. of Terminals: 18
No. of Words: 2048 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: TTL
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Memory Density: 8192 bit
Memory IC Type: OTP ROM
Minimum Operating Temperature: 0 Cel
Memory Width: 4
Qualification: Not Qualified
Package Equivalence Code: DIP18,.3
Maximum Access Time: 55 ns
No. of Words Code: 2K
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products