Texas Instruments - TBP24S81N

TBP24S81N by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TBP24S81N
Description OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR; Organization: 2KX4;
Datasheet TBP24S81N Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2KX4
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.75 V
Sub-Category: OTP ROMs
Surface Mount: NO
Maximum Supply Current: 175 mA
No. of Terminals: 18
No. of Words: 2048 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T18
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Width: 7.62 mm
Memory Density: 8192 bit
Memory IC Type: OTP ROM
Minimum Operating Temperature: 0 Cel
Memory Width: 4
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP18,.3
Length: 22.48 mm
Maximum Access Time: 70 ns
No. of Words Code: 2K
Nominal Supply Voltage / Vsup (V): 5
Peak Reflow Temperature (C): NOT SPECIFIED
Parallel or Serial: PARALLEL
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 5.25 V
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