Texas Instruments - TBP18SA46NP1

TBP18SA46NP1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number TBP18SA46NP1
Description OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
Datasheet TBP18SA46NP1 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512X8
Sub-Category: OTP ROMs
Surface Mount: NO
Maximum Supply Current: 155 mA
No. of Terminals: 24
No. of Words: 512 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: TTL
JESD-30 Code: R-PDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Memory Density: 4096 bit
Memory IC Type: OTP ROM
Minimum Operating Temperature: 0 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: DIP24,.6
Maximum Access Time: 75 ns
No. of Words Code: 512
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
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