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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | OMAP3530ECBBALPD |
| Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; |
| Datasheet | OMAP3530ECBBALPD Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.2825 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.35 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
| No. of Terminals: | 515 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| No. of I/O Lines: | 188 |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| RAM Words: | 64K |
| JESD-30 Code: | S-PBGA-B515 |
| Maximum Clock Frequency: | 38.4 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | VFBGA |
| Width: | 12 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 720 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.4175 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 16 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| Length: | 12 mm |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | CAN; I2C; IRDA; PCI; SPI; UART; USB |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
